Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-04
2008-03-04
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07338902
ABSTRACT:
An epitaxial growth method includes: supporting a substrate for growth (for example, an InP substrate) with a substrate supporter, growing a compound semiconductor layer comprising 3 or 4 elements (for example, a III-V group compound semiconductor such as an InGaAs layer, AlGaAs layer, AlInAs layer and AlInGaAs layer) on the substrate for growth by metal organic chemical vapor deposition, polishing the substrate so that an angle of gradient is 0.00° to 0.03° or 0.04° to 0.24° with respect to (100) direction in the entire effective area of the substrate, and forming the compound semiconductor layer to be 0.5 μm thick or more on the substrate by using the substrate for growth.
REFERENCES:
patent: 5647917 (1997-07-01), Oida et al.
patent: 2-239188 (1990-09-01), None
patent: 8-330236 (1996-12-01), None
patent: 2750331 (1998-02-01), None
Nakamura et al., Journal of Crystal Growth, vol. 129, 1993, pp. 456-464.
Kurita Hideki
Nakamura Masashi
Birch & Stewart Kolasch & Birch, LLP
Harrison Monica D.
Jr. Carl Whitehead
Nippon Mining & Metals Co., Ltd.
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