Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-09-29
1999-12-14
McDonald, Rodney G.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419213, 20419215, 20419222, 20429803, 20429806, 20429808, C23C 1434
Patent
active
060012242
ABSTRACT:
An enhanced reactive plasma processing method and system useful for deposition of highly insulating films. A variety of alternative embodiments are allowed for varying applications. In one embodiment, a tapped inductor (13 and 14) is switched to ground (9) or some common level to achieve substantial voltage reversal of about 10% upon detection of an arc condition. This reversal of voltage is maintained long enough to either afford processing advantages or to allow restoration of uniform charge density within the plasma (5) prior to restoration of the initial driving condition. A technique for preventing arc discharges involving periodically either interrupting the supply of power or reversing voltage is effected through a timer system (22) in the power source (1).
REFERENCES:
patent: 4046659 (1977-09-01), Cormia et al.
patent: 4103324 (1978-07-01), Vandervelden et al.
patent: 4181541 (1980-01-01), LeFrancois
patent: 4194930 (1980-03-01), Tanaka et al.
patent: 4396478 (1983-08-01), Aizenshtein et al.
patent: 4610775 (1986-09-01), Phifer
patent: 4693805 (1987-09-01), Quazi
patent: 4710694 (1987-12-01), Sutphin et al.
patent: 4711767 (1987-12-01), Diederich
patent: 4792730 (1988-12-01), Mintchev et al.
patent: 4931169 (1990-06-01), Scherer et al.
patent: 4936960 (1990-06-01), Siefkes et al.
patent: 4963238 (1990-10-01), Siefkes et al.
patent: 4981566 (1991-01-01), Wurczinger
patent: 5001620 (1991-03-01), Smith
patent: 5006213 (1991-04-01), Sichmann et al.
patent: 5009764 (1991-04-01), Siefkes et al.
patent: 5015493 (1991-05-01), Gruen
patent: 5034973 (1991-07-01), Ishiyama
patent: 5074984 (1991-12-01), Sichmann et al.
patent: 5108571 (1992-04-01), Ludwig et al.
patent: 5126033 (1992-06-01), Szczyrbowski et al.
patent: 5192894 (1993-03-01), Teschner
patent: 5212425 (1993-05-01), Goebel et al.
patent: 5241152 (1993-08-01), Anderson et al.
patent: 5281321 (1994-01-01), Sturmer et al.
patent: 5286360 (1994-02-01), Szczrbowski
patent: 5300205 (1994-04-01), Fritsche
patent: 5303139 (1994-04-01), Mark
patent: 5357418 (1994-10-01), Clavel
patent: 5399252 (1995-03-01), Scherer et al.
patent: 5427669 (1995-06-01), Drummond
patent: 5478456 (1995-12-01), Humpal et al.
patent: 5507930 (1996-04-01), Yamashita et al.
patent: 5549795 (1996-08-01), Gregoire et al.
patent: 5718813 (1998-02-01), Drummond et al.
"Optical Society of America Annual Meeting," 1992 Technical Digest series, vol. 23, [Abstract].
"New Method of Arc Suppression for Reactive-DC-Magnetron Sputtering;" Williams, et al., pp. 1-16.
"A New Technique for Arc Control in DC Sputtering;" L. Anderson; 1992; pp. 325-329.
The MDX as a Strategic Tool in Reducing Arcing; Doug Schatz; 1985; pp. 1-7.
Economical Considerations on Modern Web Sputtering Technology; S. Beisswenger, et al.; 1992; pp. 128-134.
Electric Circuits, ISBN 0-201-06238-0, 1986, Nilsson, James, pp. 160, 161, 165.
Electric Circuits, (2d ed.), "Introduction to Mesh Currents" pp. 82-149.
The Basics of Sputtering, Materials Research Corp., Orangeburg, New York, (3d ed. 1980), pp. 3-42.
Press Release, "New Arc-Check.TM. Provides Sustained Arc Control," Advanced Energy Industries, Inc., Fort Collins, CO., 1988.
"MDX-10K Series DC Magnetron Drives," Advanced Energy Industries, Inc., Fort Collins, CO., 1988.
"Arcing Problems Encountered During Sputter Deposition of Aluminum," Thomas C. Grove, Application Note Issued by Advanced Energy Industries, Inc., Fort Collins, CO 1986.
Excerpts from an European patent Office action related to the parent case.
Drummond Geoffrey N.
Scholl Richard A.
Advanced Energy Industries Inc.
McDonald Rodney G.
Santangelo Luke
LandOfFree
Enhanced reactive DC sputtering system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Enhanced reactive DC sputtering system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Enhanced reactive DC sputtering system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-859621