Encapsulation method for SBGA

Details Encapsulation method for SBGA Encapsulation method for SBGA

2006-12-26

2006-12-26

Pham, Thanhha S. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S787000

Reexamination Certificate

active

07154185

ABSTRACT:
A method for encapsulating an integrated circuit chip is described. An intergrated circuit chip is attached to a substrate; a stress buffering material only covers corners of the integrated circuit chip; and an encapsulation material coats the integated circuit chip and a portion of the substrate.

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