Embedded integrated circuit packaging structure

Details Embedded integrated circuit packaging structure Embedded integrated circuit packaging structure

2006-09-05

2006-09-05

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C361S760000, C361S761000, C361S785000

Reexamination Certificate

active

07102240

ABSTRACT:
An embedded IC packaging structure is disclosed. The embedded IC packaging structure allows a micro-electro-mechanical system (MEMS) having a great number of electrodes to be bonded to another semiconductor device, such as a driver IC, using a secondary substrate, thus ensuring an easy bonding process, providing IC devices capable of executing high-speed signal processing, reducing the production costs, and improving the production yield of the IC devices.

REFERENCES:
patent: 5311360 (1994-05-01), Bloom et al.
patent: 6096576 (2000-08-01), Corbin et al.
patent: 6303986 (2001-10-01), Shook
patent: 6396711 (2002-05-01), Degani et al.
patent: 6452260 (2002-09-01), Corbin et al.

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