4. Optical: systems and elements
  5. Optical modulator
  6. Having particular chemical composition or structure

Heung-Woo Park

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Embedded integrated circuit packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Micro-electro-mechanical system (MEMS) package with side...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Miniature optical modulator module using flexible printed...

Optical: systems and elements – Optical modulator – Having particular chemical composition or structure
Reexamination Certificate

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Miniature optical modulator module using flexible printed...

Optical: systems and elements – Optical modulator – Having particular chemical composition or structure
Reexamination Certificate

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Semi-conductor chip package capable of detecting open and short

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2368407

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