Electrostatic clamp with lip seal for clamping substrates

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H02N 1300

Patent

active

058054081

ABSTRACT:
An electrostatic clamping apparatus with lip seal for holding substrates in a vacuum processing chamber. The apparatus includes an electrostatic clamp, a sealing member surrounding the electrostatic clamp, and an edge ring surrounding the sealing member and holding the sealing member in place against the electrostatic clamp. The sealing member provides a seal between the electrostatic clamp and the substrate. This seal prevents the leakage of temperature control gas into the processing chamber and prevents process gas from reaching the electrostatic clamp and/or causing arcing in the chamber. In addition, by leaving a small gap between the sealing surface of the resilient sealing member and the edge of the electrostatic clamp, a helium distribution channel is created outside the electrostatic clamp top surface thus maximizing available contact area between the substrate and the clamp.

REFERENCES:
patent: 4340462 (1982-07-01), Koch
patent: 4534816 (1985-08-01), Chen et al.
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4665463 (1987-05-01), Ward et al.
patent: 4692836 (1987-09-01), Suzuki
patent: 4948458 (1990-08-01), Ogle
patent: 5013400 (1991-05-01), Kurasaki et al.
patent: 5055964 (1991-10-01), Logan et al.
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5160152 (1992-11-01), Toraguchi et al.
patent: 5200232 (1993-04-01), Tappan et al.
patent: 5238499 (1993-08-01), van de Ven et al.
patent: 5262029 (1993-11-01), Erskine et al.
patent: 5292399 (1994-03-01), Lee et al.
patent: 5326725 (1994-07-01), Sherstinsky
patent: 5350479 (1994-09-01), Collins et al.
patent: 5452177 (1995-09-01), Frutiger
patent: 5636098 (1997-06-01), Salfelder et al.
Reactive Ion Etching Technology In Thin-Film-Transistor Processing, Y. Kuo, IBM J. Res. Develop., vol. 36, No. 1 (Jan. 1992), pp. 69-75.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrostatic clamp with lip seal for clamping substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrostatic clamp with lip seal for clamping substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic clamp with lip seal for clamping substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1288832

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.