Electrostatic chucking stage and substrate processing apparatus

Details Electrostatic chucking stage and substrate processing apparatus Electrostatic chucking stage and substrate processing apparatus

2007-02-13

2007-02-13

Kacker, Ram N (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C156S345510, C156S345520, C361S234000, C279S128000, C118S724000, C118S725000, C118S728000

Reexamination Certificate

active

10413137

ABSTRACT:
This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses optimum total thickness of the ESC stage, optimum volume ratio of composite which the moderation layer is made of, and an optimum range of the thermal expansion coefficient of the composite. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

REFERENCES:
patent: 6178919 (2001-01-01), Li et al.
patent: 6209480 (2001-04-01), Moslehi
patent: 6272002 (2001-08-01), Mogi et al.
patent: 6549393 (2003-04-01), Kanno et al.
patent: 6756132 (2004-06-01), Fujii et al.
patent: 10270540 (1998-10-01), None

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