Electrostatic chucking stage and substrate processing apparatus

Details Electrostatic chucking stage and substrate processing apparatus Electrostatic chucking stage and substrate processing apparatus

2007-05-22

2007-05-22

Kackar, Ram N. (Department: 1763)

Coating apparatus

Gas or vapor deposition

With treating means

C118S724000, C118S728000, C361S234000, C279S128000, C156S345530

Reexamination Certificate

active

10413136

ABSTRACT:
This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.

REFERENCES:
patent: 5539179 (1996-07-01), Nozawa et al.
patent: 5740009 (1998-04-01), Pu et al.
patent: 6178919 (2001-01-01), Li et al.
patent: 6209480 (2001-04-01), Moslehi
patent: 6272002 (2001-08-01), Mogi et al.
patent: 6490146 (2002-12-01), Wang et al.
patent: 6503368 (2003-01-01), Kholodenko et al.
patent: 6535371 (2003-03-01), Kayamoto et al.
patent: 6549393 (2003-04-01), Kanno et al.
patent: 6756132 (2004-06-01), Fujii et al.
patent: 10041377 (1998-02-01), None
patent: 10270540 (1998-10-01), None
patent: 11-157953 (1999-06-01), None

Affiliated with

Also associated with

Rating

Electrostatic chucking stage and substrate processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrostatic chucking stage and substrate processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic chucking stage and substrate processing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3801938