4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

Colin D. Hatchard

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Electrophoretic coating methodology to improve internal package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Encapsulation method using non-homogeneous molding compound...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate

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Method and apparatus for achieving bond pad crater sensing...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate

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Method and apparatus to achieve bond pad crater sensing and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
Reexamination Certificate

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Method to improve internal package delamination and wire bond re

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Profile ID: LFUS-PAI-P-587591

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