Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-09-20
2005-09-20
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C356S401000
Reexamination Certificate
active
06946303
ABSTRACT:
The present invention is a system for creating a signature of a substrate manufactured in a semiconductor or data storage fabrication facility. A central processing unit is configured to receive external sensor data from a plurality of equipment-types located within the facility and integrate the external sensor data, by combining the data into a unitary whole, to create the signature for the substrate. Additionally, the present invention is a method for creating a signature of the substrate by selecting a substrate from the facility process line, receiving external sensor data associated with the substrate from a plurality of equipment-types, and integrating the external sensor data associated with the substrate to create the signature of the substrate. The created substrate signature may also be compared with other substrate signatures to electronically diagnose a process, equipment associated with the process, or a processed substrate.
REFERENCES:
patent: 4655598 (1987-04-01), Murakami et al.
patent: 4769523 (1988-09-01), Tanimoto et al.
patent: 5995234 (1999-11-01), Nishi
patent: 6303395 (2001-10-01), Nulman
patent: 6430572 (2002-08-01), Steffan et al.
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Screenshot examples of Brookside's DataViewer, AspenTech's Process Explorer, Symphony Systems' SET, and Triant Technologies Viewer.
U.S. Appl. No. 10/310,591, filed Dec. 4, 2002, Janet M. Flanner, System and Method for Creating a Substrate Signature.
Flanner Janet M.
Vetter James C.
Carr & Ferrell LLP
Lam Research Corporation
Niebling John F.
Stevenson Andre′
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