Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-09-28
2008-08-05
Picardat, Kevin M (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S107000, C438S108000
Reexamination Certificate
active
07407883
ABSTRACT:
An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.
REFERENCES:
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 3956052 (1976-05-01), Koste et al.
patent: 4521449 (1985-06-01), Arnold et al.
patent: 4753694 (1988-06-01), Herron et al.
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 5127986 (1992-07-01), August et al.
patent: 5185502 (1993-02-01), Shepherd et al.
patent: 5240671 (1993-08-01), Carey
patent: 5309629 (1994-05-01), Traskos et al.
patent: 5691572 (1997-11-01), Chung
patent: 5846361 (1998-12-01), Fasano et al.
patent: 6090703 (2000-07-01), Bandyopadhyay et al.
patent: 6127264 (2000-10-01), Bandyopadhyay et al.
patent: 6350334 (2002-02-01), Shigemi et al.
patent: 6350957 (2002-02-01), Shingai et al.
patent: 6353261 (2002-03-01), Weling
patent: 6359329 (2002-03-01), Kikuta
patent: 6388207 (2002-05-01), Figueroa et al.
patent: 6423558 (2002-07-01), Maeda et al.
patent: 6815046 (2004-11-01), Mandai et al.
patent: 6919637 (2005-07-01), He et al.
patent: 7345807 (2008-03-01), Malone
patent: 48-34674 (1973-05-01), None
Bezama Raschid J
Natarajan Govindarajan
DeLio & Peterson LLC
International Business Machines - Corporation
Nowak Kelly M.
Petrokaitis Joseph
Picardat Kevin M
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