4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Incorporating resilient component

Charles I. Delheimer

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active

Electronic module with form in-place pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Method of mounting a leadless package and structure therefor

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate

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Microwave communication package

Communications: radio wave antennas – Antennas – Microstrip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2766686

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