Electronic component with a plastic package and method for...

Details Electronic component with a plastic package and method for... Electronic component with a plastic package and method for...

2007-10-02

2007-10-02

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Reexamination Certificate

active

10484443

ABSTRACT:
An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

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