Electronic component mounting apparatus and electronic...

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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C029S739000

Reexamination Certificate

active

10857940

ABSTRACT:
In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.

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patent: 6178621 (2001-01-01), Shida et al.
patent: 6892447 (2005-05-01), Yamauchi et al.
patent: 2001/0047586 (2001-12-01), Kawai et al.
patent: 4-94553 (1992-03-01), None
patent: 4-223349 (1992-08-01), None
patent: 8-203966 (1996-08-01), None
patent: 10-163273 (1998-06-01), None
patent: 11-297764 (1999-10-01), None

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