Electroless metal deposition of electronic components in an encl

Details Electroless metal deposition of electronic components in an encl Electroless metal deposition of electronic components in an encl

1999-09-14

2000-12-26

Meeks, Timothy

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

438678, 427 98, 427123, 427125, 427601, 427304, 427305, 427347, 427437, 427438, 4274431, 4273831, H01L 2131, B05D 118, B05D 310

Patent

active

061659126

ABSTRACT:
The present invention provides methods of electrolessly depositing metal onto the surfaces of electronic components using an enclosable single vessel. The methods of the present invention include contacting the electronic components with an activation solution followed by contacting the electronic components with a metal deposition solution. In a preferred embodiment of the present invention, the oxygen levels in the activation solution and metal deposition solution are controlled in a manner for improved processing results. In another preferred embodiment of the present invention, the activation and metal deposition solutions are used one time without reuse.

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