Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2006-09-19
2006-09-19
Nhu, David (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S692000
Reexamination Certificate
active
07109118
ABSTRACT:
A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
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Cohen Adam L.
Le Qui T.
Lockard Michael S.
Smalley Dennis R.
Microfabrica Inc.
Nhu David
Smalley Dennis R.
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