Metal treatment – Barrier layer stock material – p-n type – With recess – void – dislocation – grain boundaries or channel...
Patent
1993-03-12
1995-04-11
Hearn, Brian E.
Metal treatment
Barrier layer stock material, p-n type
With recess, void, dislocation, grain boundaries or channel...
437 62, 437 63, 437 67, 437 68, H01L 2930
Patent
active
054054540
ABSTRACT:
A silicon substrate comprises, at least two surfaces extending substantially along respective crystal faces of (111) crystal orientation of the silicon, the crystal faces of (111) crystal orientation crossing with each other, an electrically insulating layer formed by oxidizing the silicon substrate from the surfaces, and an electrically conductive portion insulated electrically by the electrically insulating layer from an outside of the silicon substrate.
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Hirai Yoshihiko
Morimoto Kiyoshi
Niwa Masaaki
Okada Kenji
Terui Yasuaki
Dang Trung
Hearn Brian E.
Matsushita Electric - Industrial Co., Ltd.
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