Electrical feed-through structure and method

Details Electrical feed-through structure and method Electrical feed-through structure and method

2007-01-16

2007-01-16

Berman, Jack I. (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C174S151000, C174S008000, C174S0170SF, C174S050560

Reexamination Certificate

active

10072607

ABSTRACT:
Electrical lead-through systems from atmospheric into vacuum environments are presented. Electrical feed-through structures (EFTS) comprised of a multiplicity of parallel connection lines used to operate e-beam tip-array sources in high vac environments for chip lithography are disclosed. In one embodiment, an EFTS comprises a sheet of insulating material having conductive tracks extending along potions of the sheet and a vacuum seal separating one portion from another portion of the sheet so as to maintain a pressure differential among multiple portions of the sheet.

REFERENCES:
patent: 4647133 (1987-03-01), Renken et al.
patent: 6787780 (2004-09-01), Hamaguchi et al.
patent: 6806557 (2004-10-01), Ding

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