Elastomer bonding of large area sputtering target

Details Elastomer bonding of large area sputtering target Elastomer bonding of large area sputtering target

2005-09-12

2009-06-23

Tucker, Philip C (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S381000, C156S382000, C156S385000, C156S386000, C156S583100, C204S298120, C204S298140

Reexamination Certificate

active

07550055

ABSTRACT:
Embodiments of the present invention generally relate to sputtering targets used in semiconductor manufacturing. In particular, the invention relates to bonding the sputtering target to a backing plate that supports the sputtering target in a deposition chamber. In one embodiment, a method of bonding at least one sputtering target tile to a backing plate comprises providing an elastomeric adhesive layer between the at least one sputtering target tile and the backing plate, and providing at least one metal mesh within the elastomeric adhesive layer, wherein at least a portion of the at least one metal mesh contacts both the at least one sputtering target tile and the backing plate, and the at least a portion of the at least one metal mesh is made of metal wire with diameter greater than 0.5 mm.

REFERENCES:
patent: 4259403 (1981-03-01), Tomlinson
patent: 5250467 (1993-10-01), Somekh et al.
patent: 5356835 (1994-10-01), Somekh et al.
patent: 5507897 (1996-04-01), Campet et al.
patent: 5595337 (1997-01-01), Demaray et al.
patent: 5736021 (1998-04-01), Ding et al.
patent: 5799860 (1998-09-01), Demaray et al.
patent: 5877087 (1999-03-01), Mosely et al.
patent: 5879523 (1999-03-01), Wang et al.
patent: 5903428 (1999-05-01), Grimard et al.
patent: 5976327 (1999-11-01), Tanaka et al.
patent: 5976334 (1999-11-01), Fu et al.
patent: 6001227 (1999-12-01), Pavate et al.
patent: 6013159 (2000-01-01), Adams et al.
patent: 6045666 (2000-04-01), Satitpunwaycha et al.
patent: 6066358 (2000-05-01), Guo et al.
patent: 6080665 (2000-06-01), Chen et al.
patent: 6086725 (2000-07-01), Abburi et al.
patent: 6110828 (2000-08-01), Guo et al.
patent: 6122921 (2000-09-01), Brezoczky et al.
patent: 6126791 (2000-10-01), Pavate et al.
patent: 6169030 (2001-01-01), Naik et al.
patent: 6171455 (2001-01-01), Pavate et al.
patent: 6197167 (2001-03-01), Tanaka
patent: 6207026 (2001-03-01), Crocker
patent: 6207558 (2001-03-01), Singhvi et al.
patent: 6221221 (2001-04-01), Al-Shaikh et al.
patent: 6228186 (2001-05-01), Pavate et al.
patent: 6297147 (2001-10-01), Yang et al.
patent: 6340415 (2002-01-01), Raaijmakers et al.
patent: 6352620 (2002-03-01), Yu et al.
patent: 6355560 (2002-03-01), Mosely et al.
patent: 6391771 (2002-05-01), Naik et al.
patent: 6395157 (2002-05-01), Khurana et al.
patent: 6399479 (2002-06-01), Chen et al.
patent: 6472867 (2002-10-01), Abburi et al.
patent: 6517663 (2003-02-01), Kelley et al.
patent: 6521107 (2003-02-01), Abburi et al.
patent: 6589407 (2003-07-01), Subramani et al.
patent: 6660135 (2003-12-01), Yu et al.
patent: 6726776 (2004-04-01), Mosely et al.
patent: 6740221 (2004-05-01), Cheung et al.
patent: 6743714 (2004-06-01), Mosely et al.
patent: 6858547 (2005-02-01), Metzner et al.
patent: 7316763 (2008-01-01), Hosokawa et al.
patent: 2006/0006058 (2006-01-01), Tepman
patent: 2006/0006064 (2006-01-01), Tepman
patent: 2006/0219549 (2006-10-01), Mishima et al.
patent: 2006/0283703 (2006-12-01), Le et al.
patent: 2006/0283705 (2006-12-01), Tanase et al.
patent: 2007/0205101 (2007-09-01), Ye et al.
patent: 2007/0295596 (2007-12-01), Inagawa et al.
patent: 2008/0000770 (2008-01-01), White
patent: 1873049 (2006-12-01), None
patent: 195 27 476 (1997-01-01), None
patent: 0 461 966 (1991-12-01), None
patent: 1 728 892 (2006-12-01), None
patent: 1 811 057 (2007-07-01), None
patent: 2 053 763 (1981-02-01), None
patent: 2 055 869 (1981-03-01), None
patent: 63-317668 (1988-12-01), None
patent: 2-058478 (1990-02-01), None
patent: 2-184578 (1990-07-01), None
patent: 8-170170 (1996-07-01), None
patent: 9-003637 (1997-01-01), None
patent: 10 121232 (1998-05-01), None
patent: 10-130829 (1998-05-01), None
patent: 11-131225 (1999-05-01), None
patent: 2000 160334 (2000-06-01), None
patent: 2004-217990 (2004-08-01), None
patent: 2005002416 (2005-01-01), None
patent: 200516162 (2005-05-01), None
patent: 262954 (2006-10-01), None
patent: 263691 (2006-10-01), None
patent: 265203 (2006-11-01), None
patent: 266809 (2006-11-01), None
patent: 2005111261 (2005-11-01), None
Extended European Search Report dated Jul. 31, 2007 for European Application No. 05023286.7.
Search Report for Taiwan Invention Patent Application No. 094136405 dated Jun. 24, 2007.
“Bonding Services”,TCB Bonding Services, TCB Thermal Conductive Bonding, Inc., www.tcbonding.com/bonding.htm, 2004.
“Company”,TCB Company, TCB Thermal Conductive Bonding, Inc., www.tcbonding.com/company.htm, 2004.
Stimson, Brad and Ritchie, Alan “Enhanced PVD vacuum pumping an chamber design increases system availability,” Critical Components & Sub Systems, Semiconductor Fabtech—24THEdition, Sep. 20, 2005, pp. 155-157.
U.S. Appl. No. 11/167,520, filed Jun. 27, 2005.
“What is Sputtering? and PVD Thin Films”,TCB Sputtering, TCB Thermal Conductive Bonding, Inc., www.tcbonding.com/sputtering.htm, 2004.

Affiliated with

Also associated with

Rating

Elastomer bonding of large area sputtering target does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Elastomer bonding of large area sputtering target, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elastomer bonding of large area sputtering target will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4108542