Eigen decomposition based OPC model

Details Eigen decomposition based OPC model Eigen decomposition based OPC model

2008-07-08

2008-07-08

Dinh, Paul (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

10981750

ABSTRACT:
Model OPC is developed based on eigen decomposition of an aerial image expected to be produced by a mask pattern on a surface of a resist. With the eigen decomposition method the aerial image intensity distribution around a point (x, y) is accurately described in the model. A scalar approach may be used in the eigen decomposition model which treats the light wave through the mask as a scalar quantity. A eigen decomposition alternatively may use a vector approach which utilizes a vector to describe the light wave and the pupil function. A predicted SPIF may be generated from the aerial image which may be used to verify the mask modeling process by comparing the predicted SPIF to an experimentally determined SPIF. The model OPC, once calibrated, may be used to evaluate performance of a mask and refine features of the mask.

REFERENCES:
patent: 4894790 (1990-01-01), Yotsuya et al.
patent: 5097138 (1992-03-01), Wakabayashi et al.
patent: 5307296 (1994-04-01), Uchida et al.
patent: 5307421 (1994-04-01), Darboux et al.
patent: 5319564 (1994-06-01), Smayling et al.
patent: 5416729 (1995-05-01), Leon et al.
patent: 5621652 (1997-04-01), Eakin
patent: 5795688 (1998-08-01), Burdorf et al.
patent: 5825647 (1998-10-01), Tsudaka
patent: 5966312 (1999-10-01), Chen
patent: 6081659 (2000-06-01), Garza et al.
patent: 6223139 (2001-04-01), Wong et al.
patent: 6289499 (2001-09-01), Rieger et al.
patent: 2002/0062206 (2002-05-01), Liebchen
patent: 2003/0126581 (2003-07-01), Pang et al .
patent: 2004/0139418 (2004-07-01), Shi et al.
patent: 2004/0142251 (2004-07-01), Hsu et al.
patent: 2005/0015233 (2005-01-01), Gordon
patent: 2005/0120327 (2005-06-01), Ye et al.
patent: 2005/0142470 (2005-06-01), Socha et al.
patent: 2005/0149900 (2005-07-01), Laidig
patent: 1 329 771 (2003-07-01), None
patent: 1 439 420 (2004-07-01), None
Pati Y.C, et al. “Exploiting Structure in Fast Aerial Image Computation for Integrated Circuit Patterns.” IEEE Transactions on Semiconductor Manufacturing, Feb. 1997, IEEE, USA, vol. 10, No. 1, pp. 62-74, XP002256517.
Mack C A . et al “Metrology, Inspection, and Process Control for Microlithography XV.” Santa Clara CA, Feb. 26, 2001-Mar. 1, 2001, vol. 4344, pp. 377-384, XP 008022568.
Cobb N, et al. “Mathematical and CAD Framework for Proximity Correction.” Optical Microlithography IX, Santa Clara, CA, Mar. 13-15, 1996, vol. 2726, pp. 208-222, XP008022569.
Yeung M.S., et al. “Extension of the Hopkins theory of partially coherent imaging to include thin-film interference effects” 452/SPIE vol. 1927 Optical/Laser Microlithography VI (1993).
Randall J. et al. “Variable Threshold Resist Models for Lithography Simulation” XP008001832, PD Mar. 17, 1999, pp. 176-182.
Crisalle O.D., et al.. “A Comparison of the Optical Projection Lithography Simulators in Sample and Prolith” IEEE Translactions on Semiconductior MA, vol. 5, No. 1. Feb. 1992.
Gopalarao K. S. V. et al., “An Integrated Technology CAD System for Process and Device Designers”, IEEE Transactions on Very Lare Scale Integration (VLSI) Systems, vol. 1, No. 4, Dec. 1993.
Neubauer, G. et al., “Imaging VLSI Cross Sections by Atomic Force Microscopy”, CH3084-1/92/0000-0299$0.100 @ 1992 IEEE/IRPS.
Rodgers M., “Application of the Atomic Force Microscope to Integrated Circuit Reliability and Failure Analysis”, CH2974-4/91/0000-0250$01.00 @ 1991 IEEE/IRPS.
Qian Q.E. et al., “A New Scalar Planewave Model for High NA Lithography Simulations”, TH0640-3/94/0000-0045 $3.00 @1994 IEEE.
Barouch E. et al., “Modeling Process Latitude in UV Projection Lithography”, vol. 12, No. 10, Oct. 1991.
Beacham, J., et al., “Applications of an Atomic Force Metrology System in Semiconductor Manufacturing”, 0-8194-1160-4/93/$6.00, SPIE vol. 1926 / 311.
Peters L. “AFMs: What Will Their Role Be?” 62/Semiconductor International Aug. 1993.
“Prolith/2 User's Manual”, Version 3.0 for the Macintosh, Finie Technologies, Jul. 1993.

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