Edge die bond semiconductor package

Details Edge die bond semiconductor package Edge die bond semiconductor package

1995-04-28

1996-12-31

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257414, 257415, 257417, 257418, H01L 2982

Patent

active

055897037

ABSTRACT:
An edge die bond semiconductor package including a semiconductor die having an active major surface and a mounting edge substantially orthogonal to the active surface, a base having a mounting surface, and material affixing the mounting edge of the semiconductor die to the mounting surface of the base.

REFERENCES:
patent: 4873871 (1989-10-01), Bai et al.

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