Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1993-09-24
1994-12-06
Breneman, R. Bruce
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
156643, 427571, C23C 1400, C23C 1424, C23F 100
Patent
active
053707796
ABSTRACT:
A plasma process utilizing an electron cyclotron resonance (ECR) phenomenon caused by generating a magnetic field either parallel or perpendicular to, or both parallel and perpendicular to, a microwave propagation direction, characterized in that an ion beam is made to converge by applying a pulse voltage to a rotating magnetic field, a pulse voltage is applied to deflection plates, and an accelerating pulse voltage is further applied to a plasma.
REFERENCES:
patent: 4757237 (1988-07-01), Hellbolm et al.
patent: 5087857 (1992-02-01), Ahn
patent: 5208512 (1993-05-01), Forster et al.
Derwent Abstract of WO-8904217 dated May 18, 1989 (2 pages).
Patent Abstracts of Japan, vol. 17, No. 292 (E-1376) 4 Jun. 1993 & JP-A-50 21 392 (Fuji Electric Co. Ltd.) 29 Jan. 1993.
Patent Abstracts of Japan, vol. 13, No. 578 (E-864) 20 Dec. 1989 & JP-A-12 43 359 (Matsushita Electric Ind. Co. Ltd.).
Ohba Akira
Ohba Kazuo
Shima Yoshinori
Breneman R. Bruce
McDonald Rodney
Ohba Akira
Ohba Kazuo
Sakae Electronics Industrial Co., Ltd.
LandOfFree
ECR plasma process does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with ECR plasma process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and ECR plasma process will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-212200