Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2009-03-26
2010-12-14
Monbleau, Davienne (Department: 2893)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S007000, C438S010000, C438S050000, C438S909000, C257SE21521
Reexamination Certificate
active
07851233
ABSTRACT:
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a wafer; measuring the wafer for wafer data after the first process; securing the wafer on an E-chuck in a processing chamber; collecting sensor data from a sensor embedded in the E-chuck; adjusting clamping forces to the E-chuck based on the wafer data and the sensor data; and thereafter performing a second process to the wafer secured on the E-chuck in the processing chamber.
REFERENCES:
patent: 5350479 (1994-09-01), Collins et al.
patent: 5812361 (1998-09-01), Jones et al.
patent: 2009/0107250 (2009-04-01), Son
patent: 2010/0008016 (2010-01-01), Onate et al.
Mou Jong-I
Wang Jo Fei
Wu Sunny
Haynes and Boone LLP
Monbleau Davienne
Reames Matthew
Taiwan Semiconductor Manufacturing Company , Ltd.
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