E-beam curable resist and process for e-beam curing the resist

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S281100, C430S270100, C430S296000, C430S286100, C430S285100, C430S330000, C430S323000

Reexamination Certificate

active

06989227

ABSTRACT:
One embodiment of the present invention is a photoresist formulation that includes e-beam cross-linkable substituents, which substituents include one or more of the following functional groups: (a) carbon-carbon double bonds; (b) a strained ring system; (c) a halogenated compound; and (d) one or more organo-silicon moieties.

REFERENCES:
patent: 3594170 (1971-07-01), Broyde
patent: 3666473 (1972-05-01), Colom et al.
patent: 3770433 (1973-11-01), Bartelt et al.
patent: 4041190 (1977-08-01), Dubois et al.
patent: 4115128 (1978-09-01), Kita
patent: 4173470 (1979-11-01), Fahrenholtz et al.
patent: 4286049 (1981-08-01), Imamura et al.
patent: 4690838 (1987-09-01), Hiraoka et al.
patent: 4764247 (1988-08-01), Leveriza et al.
patent: 5003178 (1991-03-01), Livesay
patent: 5260349 (1993-11-01), Crivello
patent: 6150070 (2000-11-01), Minter et al.
patent: 6218090 (2001-04-01), Minter et al.
patent: 6255035 (2001-07-01), Minter et al.
patent: 6319655 (2001-11-01), Wong et al.
patent: 25 43 553 (1977-03-01), None
patent: 1 099 983 (2001-05-01), None
Steppan et al, Ullmann's Encyclopedia of Industrial Chemistry, “Imaging Technology. 4. Imaging for Electronics” posted on lin on Mar. 15, 2003, Wiley-VCH Verlag GmbH & Co. KGaA, 19 pages.
“Ring Systems” IUPAC (International Union of Pure and Applied Chemistry), Glossary of Class Names, 199 2 pages of 2 and 10 pages of 10 from http://www.cem.qmul.ac.uk/iupac/class.
Morrison et al, Organic Chemistry, Third Edition, Allyn and Bacon, Inc, Boston, MA, 1973, pp. 562-564.
Macintyre et al, Microelectronic Engineering, 35 (1997) 213-216.
van Delft et al , Microelectronic Engineering 46 (1999) 383-387.
Thoms et al , Microelectronic Engineering 46 (1999) 287-290.
AN 1977:460816, CAPLUS, ACS on STN, entered into STN on May 1984, English Abstract of Buchmann et al DE-2543553 A dated Mar. 31, 1977 along with registry numbers cited from Registry file obtained from ACS on STN.
Derwent-ACC-No.: 1977-23816Y, Licetia Patent-VerwGMBH [LICN], abstract of Buchmann et al DE-2543553 A1 dtaed Mar. 31, 1977.
Ross et al “Chemical Analysis of Electron Beam Curing of Positive Photresist”, SPIE vol. 2195, pp. 834-848, May 1994.
Harada et al, “Temperature Effects on Positive electron Resists Irradiated with Electron Beam and Deep-UV Light”, Journal of Applied Polymer Science, vol. 27, 1441-1452 (1982), John Wiley & Sons, Inc.
“Organic Imaging Materials, A View of the Future” by M. D. Stewart et al.,J. Phys. Org. Chem., 2000; 13: pp. 767-774.
157nm Resist Materials: Progress Report by C. Brodsky et al.,J. Vac. Sci. Technol., B 18(6), Nov./Dec. 2000, pp. 3396-3401.
“Synthesis of Siloxanes and Silsesquioxanes for 157nm Microlithography” by Hoang V. Tran, et al.,Polymeric Materials: Science&Engineering, 2001, p. 84.
Morrison et al; “Organic Chemistry” Allyn and Bacon Inc., pp. 562-564.
G.P. Moss et al.; “Glossary of Class Names of Organic . . . ” IUPAC (Recommendations 1994), pp. 1-2.
Steppan et al.; “Imaging Technology” Ullmann's Encyclopedia of Industrial Chemistry, Mar. 15, 2003; pp. 1-19.
Ring Systems; pp. 1-10.
Macintyre et al.; “High Resolution Electron Beam Lithography..” Microelectronic Engineering 35 (1997) pp. 213-216.
Van Delft et al; “DUV Resists in negative tone high . . . ” Microelectronic Engineering 46, (1999) pp. 383-387.
Thomas et al.; “Process Optimisation of DUC Photresists..” Microelectronic Engineering 46 (1999) pp. 287-290.

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