Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-06-12
2007-06-12
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S239000, C257S296000, C257S369000, C257SE27084
Reexamination Certificate
active
11165180
ABSTRACT:
The present invention discloses an improved DRAM of semiconductor device and method for manufacturing the same wherein an ONO (oxide-nitride-oxide) structure for trapping electrons or holes used in a non-volatile memory is employed in a gate insulating film of the DRAM to reduce impurity concentrations of a channel region and a well region.
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Jiankang Bu et al., “Retention Reliability Enhanced SONOS NVSM with Scaled Programming Voltage”, IEEE, 2002, pp. 5-2383-5-2389, vol. 5.
Takeshi Hamamoto et al., On the Retention Time Distribution of Dynamic Random Access Memory (DRAM); IEEE, Jun. 1998, pp. 1300-1309, vol. 45, No. 6.
Ahn Jin Hong
Kim Yil Wook
Lee Sang Don
Darrow Justin
Heller Ehrman LLP
Hynix Semiconductors Inc.
Kumar Johnny
Le Thao P.
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