Dynamic inline yield analysis and prediction of a defect...

Details Dynamic inline yield analysis and prediction of a defect... Dynamic inline yield analysis and prediction of a defect...

2011-05-03

2011-05-03

Decady, Albert (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C716S052000, C716S055000, C716S056000, C716S136000, C438S014000, C382S145000

Reexamination Certificate

active

07937179

ABSTRACT:
In one embodiment, a method for predicting yield includes calculating a criticality factor (CF) for each of a plurality of defects detected in an inspection process step of a wafer, and determining a yield-loss contribution of the inspection process step to the final yield based on CFs of the plurality of defects and the yield model built for a relevant design. The yield-loss contribution of the inspection process step is then used to predict the final yield for the wafer.

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