Dynamic control of wafer processing paths in semiconductor...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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C700S019000, C700S049000, C700S103000, C438S005000

Reexamination Certificate

active

06950716

ABSTRACT:
A semiconductor fabrication system, method and medium are disclosed. The system includes a semiconductor fabrication tool and a software application, in communication with the semiconductor fabrication tool. The semiconductor fabrication tool includes a chamber configured to perform at least one process on a semiconductor wafer. The software application is configured to determine specified qualities of the first chamber in performing the at least one process. The specified qualities are directed to at least one of: a processing time required to perform the at least one process, a rate of producing defective output products of the at least one process, a uniformity of output products of the at least one process, and a capability index of the at least one process.

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IslamRaja, M. M., C. Chang, J.P. McVitti

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