Dual gate oxide structure in semiconductor device and method...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S221000, C438S196000, C438S296000

Reexamination Certificate

active

10876277

ABSTRACT:
In the method of manufacturing a dual gate oxide layer of a semiconductor device, which has first and second active regions operating at mutually different voltages on a semiconductor substrate, the first and second active regions having a device isolation layer of STI (Shallow Trench Isolation) structure; the method of manufacturing the dual gate insulation layer includes, forming the device isolation layer so that an uppermost part thereof is positioned lower than an upper surface of the first and second active regions, before forming a gate insulation layer corresponding to each of the first and second active regions. Whereby, it is be effective till a portion of trench sidewall utilized as the active region, to increase a cell current of the active region and to prevent a stringer caused by a stepped coverage between the active region and a field region and a dent caused on a boundary face between the active region and the field region.

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patent: 6277682 (2001-08-01), Misium
patent: 6468099 (2002-10-01), Kim
patent: 6482716 (2002-11-01), Wohlfahrt
patent: 6566207 (2003-05-01), Park
patent: 6677639 (2004-01-01), Lee et al.
patent: 6683364 (2004-01-01), Oh et al.

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