Dual gate logic device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S412000, C257S369000

Reexamination Certificate

active

06891226

ABSTRACT:
The present invention features double- or dual-gate logic devices that contain gate conductors that are consistently self-aligned and that have channels that are of constant width. A single-crystal silicon wafer is utilized as the channel material. Pillars or stacks of self aligned dual gate MOSFETs are generated by etching, via the juxtaposition of overlapping germanium-containing gate conductor regions. Vertically etching through regions of both gate conducting material and dielectric insulating material provides an essentially perfect, self-aligned dual gate stack.

REFERENCES:
patent: 6518106 (2003-02-01), Ngai et al.
patent: 6551871 (2003-04-01), Takamura
patent: 6596605 (2003-07-01), Ha et al.
Jong-Ho Lee et al., “Super self-aligned double-gate (SSDG) MOSFETs utilizing oxidation rate difference and selective epitaxy,” Electron Devices Meeting, 1999, pp. 71-74.
Jong-Ho Lee, et al., IEEE IEDM 99-71 through IEDM99-74.
Hon-Sum Philip Wong, et al., IEEE IEDM 98-407 through IEDM 98-410.
Hon-Sun Philip Wong, et al., IEEE IEDM 97-427 through IEDM 97-429.

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