Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2007-06-07
2009-06-23
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S299000, C438S478000, C365S185240
Reexamination Certificate
active
07550337
ABSTRACT:
An SRAM cell structure containing a PFET gate dielectric having a thicker effective oxide thickness (EOT) than an NFET gate dielectric and methods of manufacturing the same is provided. The PFET gate dielectric and the NFET gate dielectric may be silicon oxynitride layers, CVD oxide layers, or high-K dielectric layers having different thicknesses. The PFET gate dielectric may be a stack of two dielectric layers and the NFET gate dielectric may be one of the two dielectric layers. The greater EOT of the PFET gate dielectric produces reduction of the on-current of the pull-up PFETs for optimal SRAM performance.
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Chang Leland
Narasimha Shreesh
Sleight Jeffrey W.
International Business Machines - Corporation
Rao Steven H
Scully , Scott, Murphy & Presser, P.C.
Tuchman, Esq. Ido
Weiss Howard
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