Dry-etching method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156653, 156657, 1566591, 156662, 20419235, 252 791, 427 38, B44C 122, C03C 1500, C03C 2506

Patent

active

046785396

ABSTRACT:
A dry-etching method for etching materials of the silicon group comprises: providing the material to be etched in a reaction chamber; supplying a mixed gas as the etching gas comprising carbon fluoride, oxygen and another gas wherein the other gas is a partially halogenated hydrocarbon; and thereafter subjecting the etching gas to high frequency electric current so as to make the mixed gas into a plasma whereby the material is etched.

REFERENCES:
patent: 4374698 (1983-02-01), Sanders et al.

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