Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-03-08
2011-03-08
Stark, Jarrett J (Department: 2823)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C257SE21002, C347S033000
Reexamination Certificate
active
07902085
ABSTRACT:
A droplet ejecting apparatus, method of forming a thin film, and a substrate for a display device, wherein a droplet ejecting apparatus includes a first ejecting unit ejecting a first droplet on a substrate, a second ejecting unit ejecting a second droplet on the substrate along a path defined by a movement of the first ejecting unit, and a transporting unit connected with the first ejecting unit and the second ejecting unit to transport the first ejecting unit and the second ejecting unit.
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Choi Joon-hoo
Chung Jin-Koo
Chung Kyu-Ha
Cantor & Colburn LLP
Samsung Electronics Co,. Ltd.
Stark Jarrett J
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