4. Plastic article or earthenware shaping or treating: apparatus
  5. With means applying coating material to work or work contact...
  6. Separate means applying material directly to shaping means,...

Cheol Joon Yoo

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Cleaner for molding apparatus of semiconductor chip packages

Plastic article or earthenware shaping or treating: apparatus – With means applying coating material to work or work contact... – Separate means applying material directly to shaping means,...
Reexamination Certificate

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Double-sided circuit board and multi-chip package including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2751283

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