Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2008-02-28
2010-11-30
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257SE31113, C257SE31024, C257SE23169, C257SE23024, C257SE21506, C438S051000, C438S055000, C438S064000
Reexamination Certificate
active
07843021
ABSTRACT:
The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.
REFERENCES:
patent: 7202552 (2007-04-01), Zhe et al.
patent: 7242089 (2007-07-01), Minervini
patent: 7607355 (2009-10-01), Shirasaka et al.
patent: 2007/0013052 (2007-01-01), Zhe et al.
patent: 2007/0205492 (2007-09-01), Wang
patent: WO 2005/086532 (2005-09-01), None
Choong Chong Ser
Zhe Wang
Ackerman Stephen B.
Pike Rosemary L. S.
Saile Ackerman LLC
Shandong Gettop Acoustic Co. Ltd.
Zarneke David A
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