Double patterning techniques and structures

Details Double patterning techniques and structures Double patterning techniques and structures

2011-03-29

2011-03-29

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C430S005000

Reexamination Certificate

active

07915171

ABSTRACT:
Double patterning techniques and structures are generally described. In one example, a method includes depositing a first photoresist to a semiconductor substrate, forming a first integrated circuit (IC) pattern in the first photoresist, the first IC pattern comprising one or more trench structures, protecting the first IC pattern in the first photoresist from actions that form a second IC pattern in a second photoresist, depositing the second photoresist to the first IC pattern, and forming the second IC pattern in the second photoresist, the second IC pattern comprising one or more structures that are sufficiently close to the one or more trench structures of the first IC pattern to cause scumming of the second photoresist in the one or more trench structures of the first IC pattern.

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