Double density method for wirebond interconnect

Details Double density method for wirebond interconnect Double density method for wirebond interconnect

2006-05-24

2010-02-02

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000, C438S106000

Reexamination Certificate

active

07655552

ABSTRACT:
A method, comprising bonding a first wire to a single die bond pad to form a first bond, bonding the first wire to a bond post to form a second bond, bonding a second wire to the first bond, and coupling the second wire to the bond post.

REFERENCES:
patent: 2002/0153615 (2002-10-01), Komiyama et al.
patent: 2005/0164486 (2005-07-01), Lua et al.
“Fine Pitch Ball Bonding,” Gaiser Tool Company, http://www.gaisertool.com/bonding/products/capillaries/info/fineptich.html, 1999, 3 p.
Geissinger, John; Keller, Frank; Trevino, Scott; Kamel, Toru; “Tape Based CSP Package Supports Fine Pitch Wirebonding,” The International Electronics Manufacturing Technology Symposium (IEMT 2002) Proceedings, 2002, pp. 41-45.

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