Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Inventor
active
Double density method for wirebond interconnect
Double density method for wirebond interconnect
Multi-chip assembly having a heat sink and method thereof
Packaged semiconductor with multiple rows of bond pads and...
No associations
LandOfFree
Mark Allen Gerber does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Mark Allen Gerber, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mark Allen Gerber will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-1925720