Double bumping of flexible substrate for first and second...

Details Double bumping of flexible substrate for first and second... Double bumping of flexible substrate for first and second...

2008-01-22

2008-01-22

Nadav, Ori (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S612000, C438S613000

Reexamination Certificate

active

10829778

ABSTRACT:
An apparatus and method for improving the yield and reducing the cost of forming a semiconductor device assembly. An interposer substrate is formed with interconnections in the form of conductive bumps on both a first surface and a second surface to provide a respective first level interconnect and a second level interconnect for a semiconductor die to be mounted to the interposer substrate. The conductive bumps and conductive elements may be formed simultaneously by a plating process. The conductive bumps on the first surface are arranged to correspond with bond pads of a semiconductor die for the first level interconnect. The conductive bumps on the second surface are configured to correspond with a terminal pad pattern of a carrier substrate or other higher-level packaging.

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