Diffusion furnace used for semiconductor device manufacturing pr

Details Diffusion furnace used for semiconductor device manufacturing pr Diffusion furnace used for semiconductor device manufacturing pr

1997-04-11

1999-05-11

Walberg, Teresa

Heating

Work chamber having heating means

Having means by which work is progressed or moved mechanically

432241, 118715, 118724, 118725, F27B9/04

Patent

active

059021020

ABSTRACT:
A furnace used for a semiconductor manufacturing process includes an injector that can be formed as either two or more divided tubes, having a straight-line form with each of the tubes having different lengths and open ends, or by one straight injector having a closed end and a plurality of nozzles spaced along a length of the injector. Accordingly, the furnace can easily be cleaned and handled, and a reaction gas can be uniformly distributed in the processing tube.

REFERENCES:
patent: 5522934 (1996-06-01), Suzuki et al.
patent: 5622566 (1997-04-01), Hosaka et al.

Affiliated with

Also associated with

Rating

Diffusion furnace used for semiconductor device manufacturing pr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diffusion furnace used for semiconductor device manufacturing pr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diffusion furnace used for semiconductor device manufacturing pr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-242283