Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-10-17
2006-10-17
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S738000, C257S777000, C257S780000, C257SE23021, C257SE23070
Reexamination Certificate
active
07122906
ABSTRACT:
A die-wafer package includes a singulated semiconductor die having a first plurality of bond pads on a first surface and a second plurality of bond pads on a second opposing surface thereof. Each of the first and second pluralities of bond pads includes an under-bump metallization (UBM) layer. The singulated semiconductor die is disposed on a semiconductor die site of a semiconductor wafer and a first plurality of conductive bumps electrically couples the first plurality of bond pads of the singulated semiconductor die with a first set of bond pads formed on the semiconductor die site. A second plurality of conductive bumps is disposed on a second set of bond pads of the semiconductor die site. A third plurality of conductive bumps is disposed on the singulated semiconductor die's second plurality of bond pads. The second and third pluralities of conductive bumps are configured for electrical interconnection with an external device.
REFERENCES:
patent: 5362986 (1994-11-01), Angiulli et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 6084308 (2000-07-01), Kelkar et al.
patent: 6121682 (2000-09-01), Kim
patent: 6204562 (2001-03-01), Ho et al.
patent: 6229158 (2001-05-01), Minemier et al.
patent: 6271598 (2001-08-01), Vindasius et al.
patent: 6297079 (2001-10-01), Changey et al.
patent: 6379982 (2002-04-01), Ahn et al.
patent: 6392304 (2002-05-01), Butler
patent: 6703069 (2004-03-01), Moon et al.
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 2002/0030273 (2002-03-01), Iwamoto et al.
patent: 2002/0074637 (2002-06-01), McFarland
patent: 2005/0067714 (2005-03-01), Rumer et al.
Micro)n Technology, Inc.
Parker Kenneth
TraskBritt
Warren Matthew E.
LandOfFree
Die-wafer package and method of fabricating same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die-wafer package and method of fabricating same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die-wafer package and method of fabricating same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3631702