Semiconductor device package of stacked semiconductor chips...

Details Semiconductor device package of stacked semiconductor chips... Semiconductor device package of stacked semiconductor chips...

2008-01-29

2008-01-29

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000

Reexamination Certificate

active

07323786

ABSTRACT:
A semiconductor device package includes a plurality of stacked semiconductor chips and a spacer interposed therebetween. The spacer includes a first spacer and a second spacer stacked on one another. The first and the second spacers have different principal surfaces. If the second spacer has a larger principal surface than the first spacer, flexure of the upper semiconductor chip can be avoided.

REFERENCES:
patent: 6545365 (2003-04-01), Kondo et al.
patent: 2003/0047813 (2003-03-01), Goller et al.
patent: 2004/0012079 (2004-01-01), Khiang
patent: 2002-057272 (2002-02-01), None
patent: 2002-261233 (2002-09-01), None

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