Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-05-30
1999-11-23
Chaudhuri, Olik
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438618, 438656, 438679, 438940, H01L 2160
Patent
active
059899891
ABSTRACT:
A method of creating a rerouting pattern on a semiconductor die or cube by providing a semiconductor die having an active surface with bond pads thereon and sides. A layer of electrically insulating material is sputtered over the active surface and the sides while exposing the bond pads. Electrically conductive material is formed over the electrically insulating material on the active surface and the sides. A selected portion of the electrically conductive material is removed with an excimer laser. The step of sputtering a layer of electrically insulating material over the active surface and said sides can include the steps of sputtering a layer of electrically insulating material over the active surface including the bond pads and the sides, masking the electrically insulating material to expose the region of the electrically insulating material over the bond pads and ablating the electrically insulating material with an excimer laser at the exposed region down to said bond pads. The step of forming electrically conductive material over the electrically insulating material comprises the steps of forming a layer of Ti followed by a layer of Pd followed by a layer of Au. The electrically conductive material is formed over the electrically insulating material by a modified evaporation process. Solder receiving regions are provided on one of the sides of the die or cube and the die or cube is disposed so that the solder receiving regions contact a circuit board and are soldered to the circuit board.
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Brady III Wade James
Chaudhuri Olik
Donaldson Richard L.
Eaton Kurt
Texas Instruments Incorporated
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