Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing
Reexamination Certificate
2008-09-18
2010-06-01
Lamarre, Guy J (Department: 2112)
Error detection/correction and fault detection/recovery
Pulse or data error handling
Digital logic testing
C324S763010, C326S038000, C365S200000, C365S201000
Reexamination Certificate
active
07730372
ABSTRACT:
An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM's substrate connects each die's test mode enable bond pad to one of the MCM's no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM's ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging.
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NN8607696 (Test Circuit for Detecting and Measuring a Defect-Induced Increase in the Word Line Potential of Semiconductor Arrays; IBM Technical Disclosure Bulletin: vol. #29, pp. 696-698; Jul. 1, 1986.
Duesman Kevin G.
Farnworth Warren M.
Nelson Eric S.
Wark James M.
Lamarre Guy J
Micro)n Technology, Inc.
TraskBritt
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