Determining via placement in the printed circuit board of a...

Details Determining via placement in the printed circuit board of a... Determining via placement in the printed circuit board of a...

2005-01-04

2005-01-04

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C361S782000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

06839885

ABSTRACT:
A method for determining via placement for wireless test fixture printed circuit boards (PCBs) utilizes the fixed test interface pattern of the bottom conductive pads to quickly locate the nearest bottom pad to a given top pad. The distance between the top pad and its nearest bottom pad is then calculable based on the coordinates of the respective pads on the PCB. If the distance is greater than a predetermined clearance requirement, a via is placed within the interior of the nearest bottom pad; otherwise, the via is placed exterior to the nearest bottom pad.

REFERENCES:
patent: 5451489 (1995-09-01), Leedy
patent: 20030043560 (2003-03-01), Clarkson et al.

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