Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-08-29
2006-08-29
Wilson, Lee D. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S006000, C451S008000, C451S009000, C451S010000, C451S011000, C451S041000, C451S286000, C451S287000, C451S288000
Reexamination Certificate
active
07097537
ABSTRACT:
A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.
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Birang Manoocher
Carlsson Ingemar
David Jeffrey Drue
Johansson Nils
Swedek Boguslaw A.
Applied Materials Inc.
Fish & Richardson
McDonald Shantese
Wilson Lee D.
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