Determination of nonphotolithographic wafer process-splits...

Details Determination of nonphotolithographic wafer process-splits... Determination of nonphotolithographic wafer process-splits...

2005-03-08

2005-03-08

Baumeister, Bradley (Department: 2815)

Semiconductor device manufacturing: process

With measuring or testing

C438S017000, C324S765010, C324S071500, C716S030000

Reexamination Certificate

active

06864107

ABSTRACT:
A system of testing wafer process-splits in a semiconductor wafer is provided. A first test is performed on a semiconductor wafer in a plurality of locations to obtain first data. The first data is clustered into a plurality of bins to obtain process-split locations. Second tests are performed on the semiconductor wafer in the process-split locations to obtain second data. The first data and second data arc correlated to determine process-split data.

REFERENCES:
patent: 6128403 (2000-10-01), Ozaki
patent: 6521469 (2003-02-01), La Rosa et al.
patent: 6799909 (2004-10-01), Liu et al.
patent: 20020193892 (2002-12-01), Bertsch et al.
patent: 20030036815 (2003-02-01), Krishnamurthy et al.
Chan et al. (Fast and Accurate Isothermal Measurements on Process-Split Wafers, Integrated Reliability Workshop Final Report, 2001 IEEE International, Oct. 15-18, 2001, Pp. 89-90).

Affiliated with

Also associated with

Rating

Determination of nonphotolithographic wafer process-splits... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Determination of nonphotolithographic wafer process-splits..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Determination of nonphotolithographic wafer process-splits... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3369389