Detecting trace levels of copper

Semiconductor device manufacturing: process – With measuring or testing

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75726, 73 6142, G01N 128

Patent

active

061469092

ABSTRACT:
The specification describes an analytical technique for determining trace levels of copper in a background matrix of titanium by dissolving the titanium and the copper impurity in HF, then selectively depositing the copper on a clean silicon surface. The silicon surface is then analyzed for the trace level of copper.

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