4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

David Gerald Coult

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active

Article comprising a standoff complaint metallization and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Detecting trace levels of copper

Semiconductor device manufacturing: process – With measuring or testing
Patent

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In-situ automated contactless thickness measurement for...

Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate

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Kinetically controlled solder

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Kinetically controlled solder bonding

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1324118

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