Design for sputter targets to reduce defects in refractory metal

Details Design for sputter targets to reduce defects in refractory metal Design for sputter targets to reduce defects in refractory metal

1992-03-19

1993-12-21

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, 20429819, C23C 1434

Patent

active

052718174

ABSTRACT:
A sputter target assembly includes a main target plate formed of a refractory material, such as Ti/W, which provides a target surface which is bombarded by ions and from which is ejected refractory material for thin-film deposition. A removable center piece is formed of a refractory material and fits within a recess formed in the center region of the main target plate to provide a surface which is substantially coplanar with the target surface of the main target. The removable center piece is attached to the main target plate with a screw formed of a refractory material. The main target plate is bonded to a backing plate for cooling.

REFERENCES:
patent: 4421628 (1983-12-01), Quaderer
patent: 4448652 (1984-05-01), Pachonik
patent: 4485000 (1984-11-01), Kawaguchi et al.
patent: 4966676 (1990-10-01), Fukasawa et al.
patent: 5066381 (1991-11-01), Ohta et al.
Vossen et al., "Thin Film Processes", Academic Press, New York, 1978, p. 41.

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