Design for flip chip joint pad/LGA pad

Details Design for flip chip joint pad/LGA pad Design for flip chip joint pad/LGA pad

1996-09-30

1998-09-22

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257668, 257780, 257786, 361767, H01L 2348, H01L 23495, H01L 2352, H01L 2940

Patent

active

058118837

ABSTRACT:
A substrate for an integrated circuit package is provided. The substrate includes a first dielectric layer with a first coefficient of thermal expansion. The first dielectric layer has a bottom surface and an inner side surface. The inner side surface defines a first aperture. The substrate also includes a conductive pad having a bottom surface and a side surface. The side surface of the conductive pad engages the inner side surface of the first dielectric layer. The substrate further includes a second dielectric layer having a second coefficient of thermal expansion closely matching the first coefficient of thermal expansion. The second dielectric layer is deposited upon the bottom surface of the first dielectric layer and upon a first portion of the bottom surface of the conductive pad. The first portion of the bottom surface of the conductive pad is adjacent to the side surface of the conductive pad.

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